3d Ic Technology
3D IC TECHNOLOGY
AN ADVANCEMENT IN VLSI
ABSTRACT: There are several development initiatives involving form factor of IC technology, with the much spoken-about difficulty of progressing along the Moore’s curve. 3D IC technology assures higher levels of miniaturization and integration, focuses on portraying advances in interconnect technologies, and a reduction of interconnect delays. 3D IC technologies guarantee a significant increase in functionality and performance of components by a heterogeneous integration of materials, devices, and signals. “The adoption of 3D ICs integration technology in different applications is likely to be driven by its capability to reduce process cost, enhance interconnect density, and offer smaller form factors,” notes the analyst of this research. “Although through silicon vias (TSV) has categorically evolved to be a highly competent solution for performance when gauged with conventional interconnect technologies, the industry is still in the process of establishing it as a commercially viable solution for dominant penetration in diverse application sectors.” Currently, the industry is in a position to leverage the capabilities of 3D IC solutions in the image sensors market. Memory stacking is next in line with image sensors in terms of adoption of 3D IC technologies. At the bottom rung, 3D IC solutions will find opportunities in applications that involve homogeneous integration, while scientists are working toward a technology for applications that need heterogeneous integration of wafers.
1.INTRODUCTION: This paper titled 3D IC Technology- AN ADVANCEMENT IN VLSI provides an insight into the technology development scenario of three-dimensional integrated circuit (3D IC) technologies. This research service also provides a detailed review of the key developmental efforts around the globe, funding scenario, patent analysis, and insights into the key growth patterns that mark
AN ADVANCEMENT IN VLSI
ABSTRACT: There are several development initiatives involving form factor of IC technology, with the much spoken-about difficulty of progressing along the Moore’s curve. 3D IC technology assures higher levels of miniaturization and integration, focuses on portraying advances in interconnect technologies, and a reduction of interconnect delays. 3D IC technologies guarantee a significant increase in functionality and performance of components by a heterogeneous integration of materials, devices, and signals. “The adoption of 3D ICs integration technology in different applications is likely to be driven by its capability to reduce process cost, enhance interconnect density, and offer smaller form factors,” notes the analyst of this research. “Although through silicon vias (TSV) has categorically evolved to be a highly competent solution for performance when gauged with conventional interconnect technologies, the industry is still in the process of establishing it as a commercially viable solution for dominant penetration in diverse application sectors.” Currently, the industry is in a position to leverage the capabilities of 3D IC solutions in the image sensors market. Memory stacking is next in line with image sensors in terms of adoption of 3D IC technologies. At the bottom rung, 3D IC solutions will find opportunities in applications that involve homogeneous integration, while scientists are working toward a technology for applications that need heterogeneous integration of wafers.
1.INTRODUCTION: This paper titled 3D IC Technology- AN ADVANCEMENT IN VLSI provides an insight into the technology development scenario of three-dimensional integrated circuit (3D IC) technologies. This research service also provides a detailed review of the key developmental efforts around the globe, funding scenario, patent analysis, and insights into the key growth patterns that mark