TITLE OF THE PAPER
Manufacturing an environmentally friendly PCB using existing industrial processes and equipment
A. Ryan, H. Lewis
Robotics and Computer-Integrated Manufacturing 23 (2007) 720–726 This paper investigates the possibility of utilising an additive screen printing process with conductive ink and adhesive together with a degradable substrate to identify whether this process offers a viable alternative to current subtractive methods of PCB manufacture.Existing manufacturing equipment and production process were adopted in order to establish the compatibility of a sustainable and environmental friendly PCB with these processes. Experimental trials have shown that by using a stainless steel stencil 150 mm thick in conjunction with an MPM Ultraprint machine with a printing speed of 89 mm/s, a squeegee pressure of 0.97 bar and a downstop of 1.9 mm successful printing of the electrically conductive adhesive was achieved. It was also shown that the substrate was compatible with electronic placement technology and convection oven. Comparisons of the electronic assemblies to an industrial IPC standard illustrated that it is possible to develop a circuit, which is deemed acceptable under this standard. It can be concluded therefore that a screen printed conductive ink pattern, when printed on a degradable substrate can offer a viable alternative to current printed circuit boards and can be manufactured using existing technology and manufacturing processes. 2
Optimisation for Surface Mount Placement Machines
1Masri Ayob , 2Peter Cowling, And 3Graham Kendall.
3Automated Scheduling, Optimisation and Planning (ASAP) Research Group,
Optimisation of feeder setup and component placement sequence are very important to the efficiency of surface mount placement machines. Much works have been conducted to solve this problem. However, the technological characteristics of the placement machine influences the nature of the planning problems to be solved and the formulation of the associated models. As a result, little consensus exists as to what a suitable model should be for a given machine characteristics, and the formulations proposed by different authors tend to be difficult to compare. Hence, this paper will survey the relation between models, assembly machine technologies and heuristic methods. Keywords:
Modelling, Optimisation, Electronic Assembly, Printed Circuit Board Assembly, SMT.
Inline Component Placement Inspection:
Lowering PCB Assembly Costs with Continuous Quality Improvement
Bob Kelley and John Weisgerber
In-line inspection during SMT assembly is becoming a requirement to assure the quality of today’s electronic products and to reduce the manufacturer’s costs of scrap and rework. It is important to simultaneously meet the goals of producing a cost competitive product while continuing to meet or exceed customers’ quality expectations. An effective way to work towards this goal is to implement Continuous Quality Improvement (CQI). Two of the basic principals in implementing CQI are to “continuously improve all processes” and to “mobilize data and team knowledge to improve decision making”. REF 1In-line inspection during SMT assembly provides the data and knowledge needed for this effort. There are three major applications for inspection during SMT assembly: solder paste inspection before component placement, component placement inspection before reflow, and post-reflow inspection, which often includes some type of solder joint checking. This article focuses on the uses of automated inspection technology for component placement before reflow. (See the Sidebar “Choose the Right Place for In-Line Inspection” for a summary of in-line inspection applications.) In-line inspection for component placement is becoming more popular as component sizes continue to shrink, boards become smaller and more densely populated, placement rates become faster,...
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