Diamond Wire Saw Machining
The process monitoring and mechanics of fixed abrasive diamond wire saw machining are investigated in this study. New techniques to affix diamond particles to a steel wire core have advanced to make this process feasible for the machining of ceramics, wood, and foam materials. Developments in fixed abrasive diamond wire machining are first reviewed. Advantages of using fixed abrasive diamond wire machining are then introduced. The process monitoring and signal processing techniques for measuring the cutting forces, wire speed, down feed rate, and wire bow angle in diamond wire saw machining are developed. The application of a capacitance sensor to measure the wire bow and a procedure to convert the wire bow to vertical cutting force in a rocking motion wire saw machine are developed. The tension force of the wire during cutting is also derived and discussed. Keywords: Diamond wire saw; Wire saw machining; Process monitoring
Slicing single crystal silicon into thin wafers with minimum warp, uniform thickness, and low kerf loss has revitalized the interest in wire saw machining technology, a concept that originated from the carpenter wire saw for wood machining. The early wire saw wafer slicing development in the 1990s applied a loose abrasive slurry on bare wire. During machining, a small portion of the abrasive is impregnated as third-body between the wire and workpiece to generate the cutting action. This process has been successfully implemented in silicon and silicon carbide wafer production using silicon carbide and diamond, respectively, as the loose abrasive. To further reduce the processing time and to machine other harder and more difficult-to-machine ceramic materials, new diamond impregnated wires and wire saw machines that use the wire with fixed diamond abrasive have been developed. The goal of this research is to study the fixed abrasive diamond wire saw machining technologies, including process...
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