Preview

Bipolar Complementary Metal Oxide Semiconductor Process Technology and Integration

Powerful Essays
Open Document
Open Document
11159 Words
Grammar
Grammar
Plagiarism
Plagiarism
Writing
Writing
Score
Score
Bipolar Complementary Metal Oxide Semiconductor Process Technology and Integration
Unit-II: MOS/BiCMOS Process Technology and Integration

Introduction

BiCMOS = CMOS + Bipolar (BJT) structures on the same substrate.

Advantanges of CMOS device:

1. Low Power

2. High digital IC density.

Advantages of Bipolar transistors:

1. Ability to deliver large drive currents

2. Capability to rapidly charge heavy loads.

The implementation of digital bipolar circuits with emitter-coupled logic (ECL) gates permits small logic swings and excellent noise immunity.

The integration of high-density, low- power CMOS logic arrays and high-speed bipolar drivers produces gate arrays that not only are faster than comparable CMOS but consume far less power than fellow ECL arrays whose device density is approximately the same. Both analog and digital functions can be integrated on the same BiCMOS chip, and the selection between a transistor-transistor logic (TTL) or ECL interface is possible at the expense of process complexity, involving complex technology development, the chip-manufacturing task, a longer processing time, and higher production costs.

=> The BiCMOS technology is not pursued to replace the CMOS technology that is currently employed in digital systems and requires low and medium performance.

.

The Realization of BiCMOS Processes

The BiCMOS circuits used earlier are CMOS intensive, due to the limitation in power dissipation of the bipolar devices. Hence the BiCMOS technologies have evolved from the CMOS processes. The initial approach was to graft auxiliary steps to well-established CMOS processes, to produce bipolar devices without degrading the characteristics of the CMOS transistors.

Groups/Types of BiCMOS technologies:

(1) Low-Cost, Medium-Speed, 5-V Digital BiCMOS Process

(2) High-Performance, High- Cost, 5-V Digital BiCMOS Process

(3) Integrated Analog/Digital BiCMOS Process.

Processes (1) & (2) are developed with the addition of a few extra mask sets to the conventional CMOS process.

You May Also Find These Documents Helpful

  • Satisfactory Essays

    Unit 7 Lab And Assignment

    • 311 Words
    • 2 Pages

    Complementary Metal Oxide Semiconductor, or CMOS, is a widely used type of semiconductor. CMOS semiconductors use both NMOS(negative polarity) and PMOS(positive polarity) circuits. Since only one of the circuit types is on at any given time, CMOS chips require less power than chips using just one type of transistor. This feature makes them convenient for use in battery-powered devices such as laptops. Personal computers also contain a small amount of battery-powered CMOS memory to hold the date, time, and the system setup parameters. To access the CMOS on most computers, press the delete key as the computer is booting.…

    • 311 Words
    • 2 Pages
    Satisfactory Essays
  • Good Essays

    The use of transistors in microprocessors and microchips (thousands of transistors may be on this chip) made possible a continuous decline in real price of computers and a continuous increase in processing power.…

    • 342 Words
    • 2 Pages
    Good Essays
  • Satisfactory Essays

    Complementary Metal Oxide Semiconductor, or CMOS, is a widely used type of semiconductor. CMOS semiconductors use both NMOS (negative polarity) and PMOS (positive polarity) circuits. Since only one of the circuit types is on at any given time, CMOS chips require less power than chips using just one type of transistor. This feature makes them convenient for use in battery-powered devices such as laptops. Personal computers also contain a small amount of battery-powered CMOS memory to hold the date, time, and the system setup parameters. To access the CMOS on most computers, press the delete key as the…

    • 494 Words
    • 2 Pages
    Satisfactory Essays
  • Satisfactory Essays

    1. Table presenting the processor model, year and transistor count for Intel processors from 1971 to the present.…

    • 308 Words
    • 5 Pages
    Satisfactory Essays
  • Satisfactory Essays

    NT110

    • 290 Words
    • 3 Pages

    From 1971 to 2012 the Intel processor transistor count has increased extremely throughout the years developing processor that meets modern pc needs. The growth in the number of transistors used in integrated circuits over the years is reasonable because, of Moore’s Law which predicted that every one year and a half to two years the capacity of the processors would double and, as we can see it is true. The growth on the transistors look surprisingly fast but at the same it is common because technology is used more than ever and to meet the needs of today’s society so reflecting on it is appropriate to say that it is growing at a normal rate. If I had to figure out when 100 billion transistors would fit on one single chip and using the of Moore’s law I would predict that it be around from 2018 to 2020.…

    • 290 Words
    • 3 Pages
    Satisfactory Essays
  • Good Essays

    ECET230 Lab1 Procedures

    • 2138 Words
    • 8 Pages

    The circuit design for this Lab is entered using Computer Aided Engineering (CAE) design tools for Altera’s programmable logic family. These tools allow the complete design, compilation, simulation, verification, and programming of a programmable logic IC to be done in one simple, user-friendly design environment.…

    • 2138 Words
    • 8 Pages
    Good Essays
  • Powerful Essays

    Eece353 Final Exam Summary

    • 1342 Words
    • 6 Pages

    UNIVERSITY OF BRITISH COLUMBIA DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING EECE 353 – Digital Systems Design Spring 2012 Review for the Final Exam…

    • 1342 Words
    • 6 Pages
    Powerful Essays
  • Satisfactory Essays

    Intel case

    • 867 Words
    • 4 Pages

    In 1970, dynamic random access memory (DRAM) had many competitive advantages over magnetic core memory. DRAM was not new technology, but no one had figured out how to mass produce it at a low cost. Intel had three different process technologies it was working on to develop DRAM but needed to determine which would give them the best competitive advantage. Multichip assembly was one approach but it was difficult to mass produce while the three-prong circuit version was too simple and could easily be copied by competitors. By creating the metal-oxide-semiconductor (MOS) transistor, Intel had a smaller product that was complex enough to prevent duplication, increase performance, and was more cost effective to build. Another advantage of the MOS technology was that it consumed lower power allowing it to reduce the risk of substitution. The MOS manufacturing process was prone to impurities, but as the process improved and yield rates rose, the MOS semiconductor grew to dominate the IC market. With Intel’s creation of the first one-kilobit DRAM, the 1103 chip, they were able to maintain dominance in the market place for two years.…

    • 867 Words
    • 4 Pages
    Satisfactory Essays
  • Powerful Essays

    Phase 1 Ip

    • 1003 Words
    • 5 Pages

    Microchips are both positive and negative sort of semiconductors. Microchips implement a certain type of purpose. A microchip can consistently perform the important function in modern electronics; nevertheless the devices were substituted by an abundant amount of compound arrays of P- and N- type semi-conductors. Microchips might include a range of 100-1,000 in number of transistors in a single joined circuit, especially proposed to perform a certain part. They are connected to integrated circuits here because microchips are the key factor in devices like radios, amplifiers, logic gates, memory storage and many other devices. (Ramsook,…

    • 1003 Words
    • 5 Pages
    Powerful Essays
  • Good Essays

    Potato Battery

    • 7327 Words
    • 30 Pages

    IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, VOL. 2, NO. 1, MARCH 2012…

    • 7327 Words
    • 30 Pages
    Good Essays
  • Best Essays

    Chen, C., Novick, G., & Shimano, K. (2006). RISC Architecture. Retrieved October 9, 2014 from…

    • 2038 Words
    • 6 Pages
    Best Essays
  • Powerful Essays

    chapter One Thick-film Hybrid Integrated Circuits Industry Overview 1.1 Thick-film Hybrid Integrated Circuits Definition(product Picture And Specifications) 1.2 Thick-film Hybrid Integrated Circuits Classification And Application…

    • 1192 Words
    • 5 Pages
    Powerful Essays
  • Powerful Essays

    Technological Singularity

    • 1771 Words
    • 8 Pages

    Moore, G. E. (1965). Cramming more components into integrated circuits, Proceedings of the IEEE, 86(1), 82-85.…

    • 1771 Words
    • 8 Pages
    Powerful Essays
  • Satisfactory Essays

    O N E LECTRON D EVICES, V OL. E D-26, NO. 4 , A PRIL 1979…

    • 2443 Words
    • 10 Pages
    Satisfactory Essays
  • Powerful Essays

    Silicon-Germanium Heterojunction Bipolar Transistors --An idea whose time has come Ankit Goyal, IIT Roorkee Tutor: Prof. S. Kal, IIT Kharagpur Presentation Overview History, need of SiGe Technology Physics behind HBTs Bandgap Engineering SiGe Strained Layer Epitaxy SiGe HBT Fabrication: Selective-Epitaxial Growth Technology aspects Some applications of Si-Ge HBTs Future Trends and conclusions 2 Silicon-Germanium Heterojunction Bipolar Transistor Saturday, December 15, 2007 History of SiGe Technology (1/2) The concept of combining silicon (Si) and germanium (Ge) into an alloy for use in transistor engineering is an old one, and was probably envisioned by Shockley in 1950.…

    • 2392 Words
    • 10 Pages
    Powerful Essays