Structural and Thermal Analysis in Ansys

Topics: Thermodynamics, Elasticity, Temperature Pages: 3 (675 words) Published: June 21, 2013
University of Alberta ANSYS Tutorials - www.mece.ualberta.ca/tutorials/ansys/CL/CAT/Coupled/Print.html

Coupled Structural/Thermal Analysis
Introduction
This tutorial was completed using ANSYS 7.0 The purpose of this tutorial is to outline a simple coupled thermal/structural analysis. A steel link, with no internal stresses, is pinned between two solid structures at a reference temperature of 0 C (273 K). One of the solid structures is heated to a temperature of 75 C (348 K). As heat is transferred from the solid structure into the link, the link will attemp to expand. However, since it is pinned this cannot occur and as such, stress is created in the link. A steady-state solution of the resulting stress will be found to simplify the analysis. Loads will not be applied to the link, only a temperature change of 75 degrees Celsius. The link is steel with a modulus of elasticity of 200 GPa, a thermal conductivity of 60.5 W/m*K and a thermal expansion coefficient of 12e-6 /K.

Preprocessing: Defining the Problem
According to Chapter 2 of the ANSYS Coupled-Field Guide, "A sequentially coupled physics analysis is the combination of analyses from different engineering disciplines which interact to solve a global engineering problem. For convenience, ...the solutions and procedures associated with a particular engineering discipline [will be referred to as] a physics analysis. When the input of one physics analysis depends on the results from another analysis, the analyses are coupled." Thus, each different physics environment must be constructed seperately so they can be used to determine the coupled physics solution. However, it is important to note that a single set of nodes will exist for the entire model. By creating the geometry in the first physical environment, and using it with any following coupled environments, the geometry is kept constant. For our case, we will create the geometry in the Thermal Environment, where the thermal effects will be applied....
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