Module 14: Essay
The follow-up product to my silicon semiconductor would be to specialize in microelectronic packaging. My product would be used primarily in high reliability components that undergo complete testing and screening to Aerospace specifications. I would use source control drawings to further refine these standards to specific product processing specifications demanded by unique system designs. Microelectronic packaging is the custom packaging and encapsulation of a desired semiconductor or microcircuit in high reliability housings. These special housings are designed to meet or enhance a semiconductor's performance. Many new power devices coming to market require special cooled surfaces or connections to maximize component thermal characteristics. My product would help provide unique metal or ceramic housings to meet each customer's mechanical, thermal, or power handling needs. Today, many state-of-the-art microcircuits are released in plastic cases, which serve only commercial or industrial uses. My product would be able to be housed in hermetic, metal or ceramic housings for operation under adverse conditions. Custom-packaged semiconductors either fill voids in today's manufacturing system designs, or provide a competitive edge to companies competing in the military marketplace. Most semiconductors used in the Aerospace sector require better thermal characteristics, improved electrical characteristics, or guaranteed radiation hardness. When using these semiconductors in space, it can be costly and tricky. An expensive satellite must stay grounded until every component is delivered. Controlling the project time clock is often critical in custom packaging. In order to save time and money, we would exercise the idea of emergency project builds. For example, a component which may take up to 50 weeks to finally ship from major semiconductor OEMs would be delivered in 20 weeks or less. All custom manufactured semiconductor and...
Please join StudyMode to read the full document