CPO Box 170, Samsung Electronics Bldg.,
1320-10 Seocho-2-dong, Seocho-gu,
Seoul, Korea 137-857
Invitation to Tender No. 15/04/2013
Procurement of Plastic Injection Molding Machines
Tender prepared by:
15th of April 2013
Objective: Invitation to submit a quotation for supply and installation of Plastic Injection Molding Machines and provision of related services on the premises of the Samsung SDI Cheona.
1. Administrative regulations
The bid should be made by using the Core Competency Proposal System (http://www.secbuy.com), which is an official channel for Samsung to receive proposals from companies, and would like to start doing business with Samsung Electronics. Only the bids sent in via online platform “Core Competency Proposal System” are accepted.
The deadline for receiving the bid is 30th of June 2013.
Questions and concerns:
Customer service department: Software R&D Center
The evaluation of the proposals shall be carried out between the 1st of July 2013 and the15th of August 2013.
The tender procedure will be conducted according to the description contained in this invitation, in the attached Special Tender Specifications, and in conformity with the rules and regulations of Samsung Electronics Supplier Evaluation System.
2. Background 3.1. Samsung Group
Samsung Electronics is part of the Samsung Group, which is a South Korean conglomerate that includes a large number of subsidiaries. Samsung’s main focus is electronics, heavy industry, construction, and defense industries. Other major subsidiaries of Samsung include insurance, advertising, and entertainment industry businesses. Samsung is one of the largest businesses in Korea, producing nearly one fifth of the country’s total exports.
Samsung entered the electronics industry in the 1960's with the formation of several electronics focused divisions. The initial electronics