Development and Manufacture of Printed Circuit Boards and Respective Mounting Technologies

Topics: Surface-mount technology, Printed circuit board, Through-hole technology Pages: 8 (780 words) Published: April 26, 2014


for BHM3722 Sesi 2013/2014

Due Date: 07-04-2014



Team members name
Matriks no (Fxxxxx)










BFM3722 SMD Technology



Assignment 1 Due Date: Monday 7th April 2014 at 12.00 pm
This is an individual assignment
Please ensure compliance to assignment SOP

CO1: Explain development and manufacture of printed circuit boards and the respective mounting technologies CO2:Explain the assembly, soldering and testing (electrical, optical,) processes in the production of mechatronic boards CO3: Evaluate general SMD related problems in manufacturing

PO 3

Design and Develop Solutions

This assignment evaluate the students’ ability to:

Understand the overview of SMD and its elements
Understand the SMT manufacturing processes and materials

1. Compare the conventional through-hole mounting technology used for printed circuit assemblies versus the surface mount technology. You may answer from the financial i.e cost and technical aspects i.e BOM , processes etc 2. SMDs are constructed with different types of lead styles. Explain the different shapes and style and comment on what you understand on the lead pitch. Question 1

Through Hole Mounting: This mounting technique involves different components which have lead wires that are led to the board through holes, hence the name. In this method, leads rely on holes in a multilayer PCB. The leads are then finally soldered to offer permanent mounting. The technology finds usage in:-

DIP aka Dual Inline Packaging
Pin Grid Array Package
Surface Mounting: This is a relatively new mounting method worked out seeing a  tremendous increase in the number of pins in Integrated Circuits. As demand for smaller weight and size of packaged weight increased, there was felt a need for a new, improved technology that came to be known as surface mount technology (SMT). In this leads are soldered on PCB surface directly rather than using hole mounting. The technology is used in:-

Flatpack Packages
Chip Carrier Packages

The Comparison Between Through Hole and Surface Mounted technology are as follows- 1. As SMC are small in size they take less space in comparison to through hole. The figure shown the difference between sizes of LED.

2. Pin count of component is increased greatly in SMT as compared to old through hole for example the micro process used today in computers PGA, FPGA etc.

3. SMC is leadless component and can be directly mounted on board surface while through hole components required drilling to mount the components. As shown in figure below.

4. The pads on the surface in SMT are not used for connection of layers on the printed wiring boards. 5. Size of through hole component is large in comparison to SMC there component density per unit area  is more in through hole component result in large size of Printed circuit board.

6. In SMT, components can be mounted on both side of PCB, this is not possible in through hole. Therefore SMC has made application possible which seems impossible with through hole. 7. SMT technology is used where large production is required which leads to low cost of unit assemblies. 8. With the help of SMC higher performance circuit can be made in small size which is prime requirement today. 9. Soldering of SMC is quite tough through manual soldering. Hence machines are required therefore big capital investment is required. 10. Designing, production, skills and technology required in SMT is very advance as compared to through hole technology. 11. Through hole technology is basically used in prototyping. 12. Soldering and de-soldering of through hole component is easy in comparison to...
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