CIST1122 Lab 5
CIST1122 Lab 5: Supporting Processors and Memory
NAME: Billy Tweedell
DATE: 03/03/14
Research the Web If Necessary
Scenario: You Are Working on a Desktop Computer
1) Why is it important to double-check the bottom of the heat sink before attaching it to the CPU socket?
To insure the surface is clean
2) What is the purpose of benchmarking?
In this case to test the limits of a processor
3) Why might you want to upgrade RAM on a system?
To improve performance
4) Why is it important to match the latencies of the older modules to the newer modules?
To insure compatibility
5) What must be true before a motherboard can take advantage of the triple memory channels on the board?
It must support the technology
6) Explain the following description of a memory module:
a. DDR3 240-pin DIMM is currently the fastest memory. It can support quad, triple, or dual channels or be installed as a single DIMM.
b. PC10600 This represents the theoretical bandwidth calculated by taking transfers per second and multiplying by 8
c. 1333MHz this is the frequency the memory operates at
7) Explain the differences between ECC memory and non-ECC memory.
ECC memory stands for error correcting code. The data path width for DIMMs is normally 64 bits with ECC the data path it 72 bits the extra 8 bits are for error checking. For ECC to work the motherboard and all installed modules must support it.
8) What feature is used on memory slots and modules to prevent modules from being inserted incorrectly?
The notch in the memory slot
9) Assume you have an Asus motherboard model number P6X58-E PRO.
a. What is the maximum amount of RAM that can be installed on this motherboard?
48 GB
b. List the memory specifications.
6 x DIMM, Max. 48GB, DDR3 2200(O.C.)/2133(O.C.)/2000(O.C.)/1866(O.C.)/1600/1333/1066 Hz Non-ECC, Un-buffered Memory
Triple Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
NAME: Billy Tweedell
DATE: 03/03/14
Research the Web If Necessary
Scenario: You Are Working on a Desktop Computer
1) Why is it important to double-check the bottom of the heat sink before attaching it to the CPU socket?
To insure the surface is clean
2) What is the purpose of benchmarking?
In this case to test the limits of a processor
3) Why might you want to upgrade RAM on a system?
To improve performance
4) Why is it important to match the latencies of the older modules to the newer modules?
To insure compatibility
5) What must be true before a motherboard can take advantage of the triple memory channels on the board?
It must support the technology
6) Explain the following description of a memory module:
a. DDR3 240-pin DIMM is currently the fastest memory. It can support quad, triple, or dual channels or be installed as a single DIMM.
b. PC10600 This represents the theoretical bandwidth calculated by taking transfers per second and multiplying by 8
c. 1333MHz this is the frequency the memory operates at
7) Explain the differences between ECC memory and non-ECC memory.
ECC memory stands for error correcting code. The data path width for DIMMs is normally 64 bits with ECC the data path it 72 bits the extra 8 bits are for error checking. For ECC to work the motherboard and all installed modules must support it.
8) What feature is used on memory slots and modules to prevent modules from being inserted incorrectly?
The notch in the memory slot
9) Assume you have an Asus motherboard model number P6X58-E PRO.
a. What is the maximum amount of RAM that can be installed on this motherboard?
48 GB
b. List the memory specifications.
6 x DIMM, Max. 48GB, DDR3 2200(O.C.)/2133(O.C.)/2000(O.C.)/1866(O.C.)/1600/1333/1066 Hz Non-ECC, Un-buffered Memory
Triple Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.