PROJECT PAGE1 ABIN
ANALYSIS ON WATER COOLING OF ELECTRONIC HEAT SINK
A PROJECT REPORT
Submitted by
ABIN ELDHOSE (910413414001)
In partial fulfillment for the award of the degree of MASTER OF ENGINEERING
IN
THERMAL ENGINEERING
FATIMA MICHAEL COLLEGE OF ENGINEERING AND
TECHNOLOGY, MADURAI -20
ANNA UNIVERSITY : CHENNAI 600 025
DECEMBER 2014 i ANNA UNIVERSITY : CHENNAI 600 025
BONAFIDE CERTIFICATE
Certified that this project report “ANALYSIS ON WATER COOLING OF
ELECTRONIC HEAT SINK” is the bonafide work of “ABIN ELDHOSE” who carried out the project work under my supervision.
SIGNATURE
SIGNATURE
T.ANANTHANATESAN
Mr. JAIGURU
HEAD OF THE DEPARTMENT
SUPERVISOR
Professor & Head(PG)
Professor
Dep. of Thermal Engineering
Dep. of Thermal Engineering
FMCET
FMCET
Senkottai Village
Senkottai Village
Madurai – Sivagangai Main Road
Madurai – Sivagangai Main Road
Madurai - 625 020
Madurai - 625 020
ii
ABSTRACT
For more than a decade, investigations have been conducted to better understand the fluid flow and heat transfer characteristics in silicon-based microchannel heat sinks designed for applications in electronic cooling. These non-circular channels and silicon based microchannel heat sinks combine the attributes of high material compatibility, high surface area per unit volume ratios and large potential heat transfer performance with highly sophisticated and economic fabrication process.
These
advantages
make
these
silicon
based
microchannel
heat
sinks
extremelyattractive for a wide variety of commercial applications.
The present work addresses electronic chips cooling with forced convection of water in
silicon based
single microchannel heat sinks
by the help of
a
commercial CFD software FLUENT. The computational domain is discretized with non-uniform grids on the flow face but uniform grid along the flow. For single microchannel, the grid is generated by implementing Gambit software, which is incorporated with Cooper method for 3-dimensional grid
A PROJECT REPORT
Submitted by
ABIN ELDHOSE (910413414001)
In partial fulfillment for the award of the degree of MASTER OF ENGINEERING
IN
THERMAL ENGINEERING
FATIMA MICHAEL COLLEGE OF ENGINEERING AND
TECHNOLOGY, MADURAI -20
ANNA UNIVERSITY : CHENNAI 600 025
DECEMBER 2014 i ANNA UNIVERSITY : CHENNAI 600 025
BONAFIDE CERTIFICATE
Certified that this project report “ANALYSIS ON WATER COOLING OF
ELECTRONIC HEAT SINK” is the bonafide work of “ABIN ELDHOSE” who carried out the project work under my supervision.
SIGNATURE
SIGNATURE
T.ANANTHANATESAN
Mr. JAIGURU
HEAD OF THE DEPARTMENT
SUPERVISOR
Professor & Head(PG)
Professor
Dep. of Thermal Engineering
Dep. of Thermal Engineering
FMCET
FMCET
Senkottai Village
Senkottai Village
Madurai – Sivagangai Main Road
Madurai – Sivagangai Main Road
Madurai - 625 020
Madurai - 625 020
ii
ABSTRACT
For more than a decade, investigations have been conducted to better understand the fluid flow and heat transfer characteristics in silicon-based microchannel heat sinks designed for applications in electronic cooling. These non-circular channels and silicon based microchannel heat sinks combine the attributes of high material compatibility, high surface area per unit volume ratios and large potential heat transfer performance with highly sophisticated and economic fabrication process.
These
advantages
make
these
silicon
based
microchannel
heat
sinks
extremelyattractive for a wide variety of commercial applications.
The present work addresses electronic chips cooling with forced convection of water in
silicon based
single microchannel heat sinks
by the help of
a
commercial CFD software FLUENT. The computational domain is discretized with non-uniform grids on the flow face but uniform grid along the flow. For single microchannel, the grid is generated by implementing Gambit software, which is incorporated with Cooper method for 3-dimensional grid