Donner Company

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OPERATIONS MANAGEMENT

DONNER COMPANY
SUBMITTED
TO

PROF. JANAT SHAH

PREPARED BY:

ABHISHEK PRASAD BURJOR DADACHANJI ROHIT GOEL JAYARAMA HOLLA

0511147 0511160 0511178 0512005

VISHAL AGGRAWAL 0511196

Donner Company

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Donner Company

TABLE OF CONTENTS
Exhibit A........................................................................................................................25 Exhibit B........................................................................................................................27

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Donner Company

INTRODUCTION
The Donner Company manufactures printed circuit boards for a variety of electronics manufacturers based on the specifications provided by them. It started operations in 1985, and is run by engineers who have substantial experience in the electronics industry. There are 750 printed circuit board manufacturers in the US market, classified as captive or contract manufacturers. The industry has shown phenomenal growth as electronics increasingly becomes a vital part of all aspects of life. The Donner Company is believed to be more adept than its competitors in creating prototypes of new designs and anticipating/resolving any problems that might be associated with these designs.

CASE FACTS
Manufacturing Process Flow
Donner produces “solder mark over bare copper” (SMOBC) boards. This process has three broad stages: 1. Preparation Stage • Master artwork received from the customer –

used to produce negative image

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Donner Company • panel • • Double sided copper-clad glass epoxy sheets – Location holes punched – used in aligning, 36” by 48” sheared into 12” by 18” panels drilling, imaging and routing 2. Image Transfer Stage • Approximately 500 holes per circuit board – Individual image repeated to maximize panel

utilization (panel size 12” by 18”) – typically 8 images per

drilled manually or using CNC drill (worth $80000) – drilling process needs the operator in both cases • Panel is processed through copper immersion bath – metallization – deposits thin layer of copper on drilled holes • • • are desired • copper • Exposed DFPR – stripped off the panel – uncopper is etched off – circuit pattern electroplated Conductors are electroplated – bare areas and metallized holes are covered by an additional layer of Panels are washed, scrubbed and coated with Film of the artwork is placed on the panel and it DFPR machines wash away un-exposed DFPR photo-resist (DFPR) is exposed to UV light leaving conducting copper surface bare where conductors

protected by tin coating

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Donner Company • Tin coating chemically stripped off – leaving the

desired circuit pattern on both sides of the board

3. Fabrication Stage • • • Protective epoxy coating over circuit traces – Through holes – covered with solder Individual boards separated from panel –

solder-mask silk-screening

reduced to desired size and shape using the CNC or a punch press • final step Boards are inspected, tested, packaged and shipped – one senior Donner employee assigned to this

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Donner Company

Figure 1: Manufacturing Process Flow The normal flow described above could be modified based on specific requirements of customers. Sometimes additional steps may also be involved. Special racks are used between process operations to hold up to 20 panels in order to reduce handling damage

Supervision Process
Supervision responsibilities are shared by three people: Diane Schnabs – expediter Group 07

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Donner Company Bruce Altmeyer – design engineer David Flaherty – shop supervisor

Figure 2: Flow of Information The expediter: Keep track of orders in process. Investigated delays, fixed problems, kept customers informed. Took charge of rush orders. The design engineer: Inspect artwork, find design errors, and create processing strategy. The shop supervisor: In charge of manufacturing, supervised 22...
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